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Phenolic Resin

product type:Phenolic Resin is a resin obtained from phenolic organic compounds and other aldehyde organic compounds through phenolic polycondensation reaction under acidic or alkaline conditions. From the point of view of form, Phen···
Product Description

Phenolic Resin

Phenolic Resin is a resin obtained from phenolic organic compounds and other aldehyde organic compounds through phenolic polycondensation reaction under acidic or alkaline conditions. From the point of view of form, Phenolic Resin can be divided into solid Phenolic Resin and liquid Phenolic Resin; and according to engineering performance, Phenolic Resin can be divided into thermoplastic Phenolic Resin and thermosetting Phenolic Resin. Our company has a complete range of Phenolic Resin products, including not only Phenolic Resin for various industrial uses, but also high-purity and modified Phenolic Resin for electronic products. We can provide suitable product models according to different purposes of customers.

Electronic grade Phenolic Resin is a new type of polymer material that is different from traditional industrial Phenolic Resin and is characterized by high purity, low free monomers, low metal impurity ions, low anion content, and high reliability.

Properties of phenolic resin:

The unique chemical structure makes Phenolic Resin have excellent physical and chemical properties such as heat resistance, acid resistance, adhesion, flame retardancy, ablation resistance, and electrical insulation, so they are widely used in industry.

Application of Phenolic Resin:

Phenolic Resin are widely used in friction materials, abrasive abrasives, refractory materials, flame retardant materials, glass fiber reinforced plastics, casting materials, molding materials, thermal insulation materials, tire rubber, oil fields, adhesives and anti-corrosion engineering and other fields. In recent years, with the rapid development of my country's electronics industry, high-purity and modified Phenolic Resin have played a very important role in the fields of printed circuit substrate materials, semiconductor packaging materials and photoresists.



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